A. M. Engwall
About
A. M. Engwall has authored 26 papers that have received a total of 413 indexed citations.
This includes 19 papers in Mechanics of Materials, 16 papers in Materials Chemistry and 9 papers in Electrical and Electronic Engineering. The topics of these papers are Metal and Thin Film Mechanics (18 papers), Diamond and Carbon-based Materials Research (9 papers) and Copper Interconnects and Reliability (8 papers). A. M. Engwall is often cited by papers focused on Metal and Thin Film Mechanics (18 papers), Diamond and Carbon-based Materials Research (9 papers) and Copper Interconnects and Reliability (8 papers) and collaborates with scholars based in United States and Ireland. A. M. Engwall's co-authors include Eric Chason, S. O. Kucheyev, J. H. Bae, S. J. Shin and L. B. Bayu Aji and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society
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