A. Nishimura
About
A. Nishimura has authored 39 papers that have received a total of 281 indexed citations.
This includes 34 papers in Electrical and Electronic Engineering, 12 papers in Mechanics of Materials and 10 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (17 papers) and Silicon and Solar Cell Technologies (6 papers). A. Nishimura is often cited by papers focused on Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (17 papers) and Silicon and Solar Cell Technologies (6 papers) and collaborates with scholars based in Japan, United States and United Kingdom. A. Nishimura's co-authors include Sueo KAWAI, Kunihiko NISHI, Hideo Miura, Makoto Kitano and Takahiko Kato and has published in prestigious journals such as Materials Science and Engineering A, IEEE Transactions on Electron Devices and IEEE Transactions on Magnetics
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