A. Primavera
About
A. Primavera has authored 8 papers that have received a total of 175 indexed citations.
This includes 8 papers in Electrical and Electronic Engineering, 2 papers in Mechanical Engineering and 1 paper in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (6 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers). A. Primavera is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (6 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers) and collaborates with scholars based in United States. A. Primavera's co-authors include James M. Pitarresi, Richard Coyle, K. Srihari, G.R. Westby and Richard R. Chromik and has published in prestigious journals such as The International Journal of Advanced Manufacturing Technology, Microelectronics Reliability and IEEE Transactions on Components and Packaging Technologies
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