Abhijit Dasgupta
About
Abhijit Dasgupta has authored 151 papers that have received a total of 2.3k indexed citations.
This includes 102 papers in Electrical and Electronic Engineering, 61 papers in Mechanics of Materials and 59 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (77 papers), 3D IC and TSV technologies (23 papers) and Mechanical Behavior of Composites (15 papers). Abhijit Dasgupta is often cited by papers focused on Electronic Packaging and Soldering Technologies (77 papers), 3D IC and TSV technologies (23 papers) and Mechanical Behavior of Composites (15 papers) and collaborates with scholars based in United States, The Netherlands and Finland. Abhijit Dasgupta's co-authors include Michael Pecht, Ed Habtour, Siddhartha Das, James S. Sirkis and D. B. Barker and has published in prestigious journals such as Acta Materialia, ACS Applied Materials & Interfaces and Nanoscale
In The Last Decade
Explore authors with similar magnitude of impact
Top countries impacted by papers by Sanjib Basu Top journals papers by Maria Chudnovsky are published in Top authors papers by Yanmei Yang are co-authored with Top authors papers by A. Ranfagni are co-authored with Top authors papers by Asahiro Morishita are co-authored with Top journals papers by Dingming Huang are published in Top countries impacted by papers by Magdalena Müller‐Gerbl Top journals papers by Jinsung Park are published in