Abhijit Dasgupta
About
Abhijit Dasgupta has authored 152 papers that have received a total of 2.3k indexed citations.
This includes 102 papers in Electrical and Electronic Engineering, 61 papers in Mechanics of Materials and 59 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (77 papers), 3D IC and TSV technologies (23 papers) and Aluminum Alloys Composites Properties (15 papers). Abhijit Dasgupta is often cited by papers focused on Electronic Packaging and Soldering Technologies (77 papers), 3D IC and TSV technologies (23 papers) and Aluminum Alloys Composites Properties (15 papers) and collaborates with scholars based in United States, The Netherlands and Finland. Abhijit Dasgupta's co-authors include Michael Pecht, Ed Habtour, Siddhartha Das, James S. Sirkis and D. B. Barker and has published in prestigious journals such as Acta Materialia, ACS Applied Materials & Interfaces and Nanoscale.
In The Last Decade
Fields of papers published by Abhijit Dasgupta
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Abhijit Dasgupta
Since SpecializationCitations
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