Adeel Bajwa

14 papers and 141 indexed citations i.

Adeel Bajwa has authored 14 papers that have received a total of 141 indexed citations. This includes 13 papers in Electrical and Electronic Engineering, 5 papers in Electronic, Optical and Magnetic Materials and 2 papers in Cellular and Molecular Neuroscience. The topics of these papers are 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (8 papers) and Copper Interconnects and Reliability (5 papers). Adeel Bajwa is often cited by papers focused on 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (8 papers) and Copper Interconnects and Reliability (5 papers) and collaborates with scholars based in United States, Germany and Norway. Adeel Bajwa's co-authors include Subramanian S. Iyer, Saptadeep Pal, Mark S. Goorsky, Puneet Gupta and Jürgen Wilde and has published in prestigious journals such as Japanese Journal of Applied Physics, Microelectronics Reliability and Plasma Processes and Polymers