Aditya P. Karmarkar
About
Aditya P. Karmarkar has authored 18 papers that have received a total of 398 indexed citations.
This includes 17 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 4 papers in Condensed Matter Physics. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (8 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (7 papers). Aditya P. Karmarkar is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (8 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (7 papers) and collaborates with scholars based in United States, Switzerland and Germany. Aditya P. Karmarkar's co-authors include Daniel M. Fleetwood, Ronald D. Schrimpf, Xiaopeng Xu, L. J. Brillson and B. D. White and has published in prestigious journals such as IEEE Transactions on Nuclear Science, IEEE Transactions on Device and Materials Reliability and Applied Mathematics and Mechanics
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