Adrian Lis
About
Adrian Lis has authored 20 papers that have received a total of 331 indexed citations.
This includes 15 papers in Mechanical Engineering, 12 papers in Electrical and Electronic Engineering and 4 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloys Composites Properties (6 papers). Adrian Lis is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloys Composites Properties (6 papers) and collaborates with scholars based in Japan, Switzerland and South Korea. Adrian Lis's co-authors include Christian Leinenbach, Wookjin Lee, Christoph Kenel, Akio Hirose and Tomokazu Sano and has published in prestigious journals such as Materials Science and Engineering A, Journal of Alloys and Compounds and Journal of Materials Processing Technology
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