Ai‐Ping Xian

32 papers and 325 indexed citations i.

Ai‐Ping Xian has authored 32 papers that have received a total of 325 indexed citations. This includes 22 papers in Electrical and Electronic Engineering, 22 papers in Mechanical Engineering and 8 papers in General Materials Science. The topics of these papers are Electronic Packaging and Soldering Technologies (20 papers), Intermetallics and Advanced Alloy Properties (10 papers) and Metallurgical and Alloy Processes (7 papers). Ai‐Ping Xian is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), Intermetallics and Advanced Alloy Properties (10 papers) and Metallurgical and Alloy Processes (7 papers) and collaborates with scholars based in China, United States and Taiwan. Ai‐Ping Xian's co-authors include Meng Liu, Lianwen Wang, Wang Zhongguang, Jin Shang and Qingquan Liu and has published in prestigious journals such as Journal of the American Ceramic Society, Journal of Materials Science and Journal of Physics Condensed Matter