Alan Huffman

39 papers and 192 indexed citations i.

Alan Huffman has authored 39 papers that have received a total of 192 indexed citations. This includes 23 papers in Electrical and Electronic Engineering, 6 papers in General Health Professions and 5 papers in Aerospace Engineering. The topics of these papers are 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (12 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers). Alan Huffman is often cited by papers focused on 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (12 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers) and collaborates with scholars based in United States and Germany. Alan Huffman's co-authors include John Lannon, D. Temple, Matthew Lueck, Scott Goodwin and Steve Solomon and has published in prestigious journals such as IEEE Transactions on Electron Devices, Annals of Emergency Medicine and Journal of Electronic Materials