Andreas Schletz
About
Andreas Schletz has authored 24 papers that have received a total of 157 indexed citations.
This includes 22 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 5 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), Silicon Carbide Semiconductor Technologies (13 papers) and Electromagnetic Compatibility and Noise Suppression (5 papers). Andreas Schletz is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), Silicon Carbide Semiconductor Technologies (13 papers) and Electromagnetic Compatibility and Noise Suppression (5 papers) and collaborates with scholars based in Germany, Japan and Denmark. Andreas Schletz's co-authors include W. Wondrak, Dawei Zhao, Markus Rauch, Martin März and L. Frey and has published in prestigious journals such as IEEE Transactions on Dielectrics and Electrical Insulation, Microelectronics Reliability and Materials science forum
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