Anmin Hu

113 papers and 2.1k indexed citations i.

Anmin Hu has authored 113 papers that have received a total of 2.1k indexed citations. This includes 88 papers in Electrical and Electronic Engineering, 42 papers in Mechanical Engineering and 19 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (63 papers), 3D IC and TSV technologies (49 papers) and Advanced Welding Techniques Analysis (19 papers). Anmin Hu is often cited by papers focused on Electronic Packaging and Soldering Technologies (63 papers), 3D IC and TSV technologies (49 papers) and Advanced Welding Techniques Analysis (19 papers) and collaborates with scholars based in China, United States and South Korea. Anmin Hu's co-authors include Ming Li, Tao Hang, Dali Mao, Huiqin Ling and Huiqin Ling and has published in prestigious journals such as ACS Nano, Journal of The Electrochemical Society and ACS Applied Materials & Interfaces