Asit Kumar Gain
About
Asit Kumar Gain has authored 62 papers that have received a total of 1.7k indexed citations.
This includes 53 papers in Mechanical Engineering, 32 papers in Electrical and Electronic Engineering and 13 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (21 papers) and Aluminum Alloys Composites Properties (17 papers). Asit Kumar Gain is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (21 papers) and Aluminum Alloys Composites Properties (17 papers) and collaborates with scholars based in Australia, Hong Kong and China. Asit Kumar Gain's co-authors include K.C. Yung, Liangchi Zhang, Liangchi Zhang, Byong‐Taek Lee and Y.C. Chan and has published in prestigious journals such as Scientific Reports, Journal of the American Ceramic Society and Materials Science and Engineering A
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