B. Fléchet
About
B. Fléchet has authored 23 papers that have received a total of 170 indexed citations.
This includes 22 papers in Electrical and Electronic Engineering, 12 papers in Electronic, Optical and Magnetic Materials and 6 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (11 papers), Semiconductor materials and devices (11 papers) and 3D IC and TSV technologies (7 papers). B. Fléchet is often cited by papers focused on Copper Interconnects and Reliability (11 papers), Semiconductor materials and devices (11 papers) and 3D IC and TSV technologies (7 papers) and collaborates with scholars based in France, Switzerland and Australia. B. Fléchet's co-authors include C. Bermond, A. Farcy, T. Lacrevaz, M. Gros‐Jean and N. Sillon and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Electron Device Letters
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