B. Kempf

20 papers and 300 indexed citations i.

B. Kempf has authored 20 papers that have received a total of 300 indexed citations. This includes 12 papers in Mechanical Engineering, 9 papers in Electrical and Electronic Engineering and 5 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), Electrical Contact Performance and Analysis (5 papers) and Advanced materials and composites (4 papers). B. Kempf is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Electrical Contact Performance and Analysis (5 papers) and Advanced materials and composites (4 papers) and collaborates with scholars based in Germany and Belgium. B. Kempf's co-authors include Markus Rettenmayr, Jef Vleugels, F. Heringhaus, Ludo Froyen and Kim Vanmeensel and has published in prestigious journals such as Acta Materialia, Journal of Alloys and Compounds and Journal of Materials Processing Technology