B. Roberds
About
B. Roberds has authored 8 papers that have received a total of 283 indexed citations.
This includes 8 papers in Electrical and Electronic Engineering, 3 papers in Biomedical Engineering and 2 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (4 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers). B. Roberds is often cited by papers focused on 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (4 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers) and collaborates with scholars based in United States. B. Roberds's co-authors include Shari Farrens, R. D. Twesten, Gang Bai, B.S. Doyle and Raj Solanki and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society
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