Bin Feng

33 papers and 506 indexed citations i.

Bin Feng has authored 33 papers that have received a total of 506 indexed citations. This includes 18 papers in Electrical and Electronic Engineering, 13 papers in Biomedical Engineering and 11 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Advanced Sensor and Energy Harvesting Materials (7 papers) and 3D IC and TSV technologies (6 papers). Bin Feng is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Advanced Sensor and Energy Harvesting Materials (7 papers) and 3D IC and TSV technologies (6 papers) and collaborates with scholars based in China, Canada and United States. Bin Feng's co-authors include Guisheng Zou, Lei Liu, Wengan Wang, Yu Xiao and Hongqiang Zhang and has published in prestigious journals such as Advanced Materials, Advanced Functional Materials and ACS Applied Materials & Interfaces