Bin Feng

34 papers and 560 indexed citations i.

Bin Feng has authored 34 papers that have received a total of 560 indexed citations. This includes 19 papers in Electrical and Electronic Engineering, 12 papers in Materials Chemistry and 12 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Advanced Sensor and Energy Harvesting Materials (6 papers) and 3D IC and TSV technologies (5 papers). Bin Feng is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Advanced Sensor and Energy Harvesting Materials (6 papers) and 3D IC and TSV technologies (5 papers) and collaborates with scholars based in China, Canada and United States. Bin Feng's co-authors include Guisheng Zou, Lei Liu, Wengan Wang, Yu Xiao and Hongqiang Zhang and has published in prestigious journals such as Advanced Materials, Nano Letters and Advanced Functional Materials.