Bin Wu
About
Bin Wu has authored 101 papers that have received a total of 3.1k indexed citations.
This includes 41 papers in Surgery, 35 papers in Biomedical Engineering and 25 papers in Electrical and Electronic Engineering. The topics of these papers are Bone Tissue Engineering Materials (25 papers), Electronic Packaging and Soldering Technologies (22 papers) and Orthopaedic implants and arthroplasty (20 papers). Bin Wu is often cited by papers focused on Bone Tissue Engineering Materials (25 papers), Electronic Packaging and Soldering Technologies (22 papers) and Orthopaedic implants and arthroplasty (20 papers) and collaborates with scholars based in China, United States and Hong Kong. Bin Wu's co-authors include Paul H. Wooley, Xiaodong Guo, Y.C. Chan, M.O. Alam and Qixin Zheng and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Biomaterials
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