Bob Willis

16 papers and 195 indexed citations i.

Bob Willis has authored 16 papers that have received a total of 195 indexed citations. This includes 8 papers in Electrical and Electronic Engineering, 2 papers in Mechanical Engineering and 2 papers in Industrial and Manufacturing Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (5 papers) and Modular Robots and Swarm Intelligence (2 papers). Bob Willis is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (5 papers) and Modular Robots and Swarm Intelligence (2 papers) and collaborates with scholars based in United Kingdom. Bob Willis's co-authors include C. H. Lea and has published in prestigious journals such as Soldering and Surface Mount Technology, Circuit World and Microelectronics International