Boon Long Lau

34 papers and 241 indexed citations i.

Boon Long Lau has authored 34 papers that have received a total of 241 indexed citations. This includes 20 papers in Mechanical Engineering, 18 papers in Electrical and Electronic Engineering and 5 papers in Biomedical Engineering. The topics of these papers are Heat Transfer and Optimization (17 papers), 3D IC and TSV technologies (13 papers) and Heat Transfer and Boiling Studies (11 papers). Boon Long Lau is often cited by papers focused on Heat Transfer and Optimization (17 papers), 3D IC and TSV technologies (13 papers) and Heat Transfer and Boiling Studies (11 papers) and collaborates with scholars based in Singapore. Boon Long Lau's co-authors include Xiaowu Zhang, Yong Han, Gongyue Tang, Yoke Choy Leong and Xiaobai Wang and has published in prestigious journals such as IEEE Electron Device Letters, IEEE Transactions on Components Packaging and Manufacturing Technology and IEEE Design and Test