Byunghoon Lee
About
Byunghoon Lee has authored 45 papers that have received a total of 338 indexed citations.
This includes 29 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 9 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (10 papers) and Advancements in Photolithography Techniques (8 papers). Byunghoon Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (10 papers) and Advancements in Photolithography Techniques (8 papers) and collaborates with scholars based in South Korea, United States and Singapore. Byunghoon Lee's co-authors include Hoo-Jeong Lee, Kee-Won Kwon, Haseok Jeon, Ja‐Myeong Koo and Maenghyo Cho and has published in prestigious journals such as Advanced Materials, ACS Nano and Biochemistry
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