C. A. Steidel
About
C. A. Steidel has authored 7 papers that have received a total of 1.0k indexed citations.
This includes 4 papers in Electronic, Optical and Magnetic Materials, 3 papers in Electrical and Electronic Engineering and 2 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (4 papers), Semiconductor materials and devices (3 papers) and Aluminum Alloy Microstructure Properties (2 papers). C. A. Steidel is often cited by papers focused on Copper Interconnects and Reliability (4 papers), Semiconductor materials and devices (3 papers) and Aluminum Alloy Microstructure Properties (2 papers) and collaborates with scholars based in United States. C. A. Steidel's co-authors include D. Gerstenberg, Che‐Yu Li, J.M. Morabito, Hiromu Kumagai and Per Kofstad and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Surface Science
In The Last Decade
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