C. Bailey
About
C. Bailey has authored 216 papers that have received a total of 2.9k indexed citations.
This includes 112 papers in Electrical and Electronic Engineering, 48 papers in Mechanical Engineering and 33 papers in Computational Mechanics. The topics of these papers are Electronic Packaging and Soldering Technologies (76 papers), 3D IC and TSV technologies (38 papers) and Silicon Carbide Semiconductor Technologies (25 papers). C. Bailey is often cited by papers focused on Electronic Packaging and Soldering Technologies (76 papers), 3D IC and TSV technologies (38 papers) and Silicon Carbide Semiconductor Technologies (25 papers) and collaborates with scholars based in United Kingdom, United States and Hong Kong. C. Bailey's co-authors include Hua Lu, M. Cross, Chunyan Yin, Marc P. Y. Desmulliez and Stoyan Stoyanov and has published in prestigious journals such as Physical Review Letters, Applied Physics Letters and IEEE Transactions on Industrial Electronics
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