C. Fuchs

3 papers and 20 indexed citations i.

C. Fuchs has authored 3 papers that have received a total of 20 indexed citations. This includes 2 papers in Electrical and Electronic Engineering, 1 paper in Biomedical Engineering and 1 paper in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (2 papers), Electronic Packaging and Soldering Technologies (2 papers) and Acoustic Wave Resonator Technologies (1 paper). C. Fuchs is often cited by papers focused on 3D IC and TSV technologies (2 papers), Electronic Packaging and Soldering Technologies (2 papers) and Acoustic Wave Resonator Technologies (1 paper) and collaborates with scholars based in France, Spain and Czechia. C. Fuchs's co-authors include A. Farcy, P. Ancey, N. Sillon, A. Reinhardt and M. Clément and has published in prestigious journals such as Microelectronic Engineering and ECS Transactions