C. Key Chung

15 papers and 298 indexed citations i.

C. Key Chung has authored 15 papers that have received a total of 298 indexed citations. This includes 10 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 6 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Advanced Welding Techniques Analysis (4 papers). C. Key Chung is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (7 papers) and Advanced Welding Techniques Analysis (4 papers) and collaborates with scholars based in Taiwan, United States and Mexico. C. Key Chung's co-authors include C. R. Kao, Alexandra Navrotsky, Tsung‐Lin Yang, Hongwu Xu and Maik Lang and has published in prestigious journals such as Acta Materialia, Corrosion Science and Journal of Alloys and Compounds.