C. Liu
About
C. Liu has authored 14 papers that have received a total of 367 indexed citations.
This includes 12 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 2 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (4 papers). C. Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (4 papers) and collaborates with scholars based in United Kingdom, Singapore and United States. C. Liu's co-authors include Vadim V. Silberschmidt, Zhong Chen, Huining Xu, Viola L. Acoff and Timothy J. White and has published in prestigious journals such as Journal of Applied Physics, Acta Materialia and Scripta Materialia
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