C.A. Smith

18 papers and 339 indexed citations i.

C.A. Smith has authored 18 papers that have received a total of 339 indexed citations. This includes 7 papers in Electrical and Electronic Engineering, 5 papers in Mechanical Engineering and 4 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), Epoxy Resin Curing Processes (4 papers) and Polymer crystallization and properties (2 papers). C.A. Smith is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Epoxy Resin Curing Processes (4 papers) and Polymer crystallization and properties (2 papers) and collaborates with scholars based in United States, Sweden and United Kingdom. C.A. Smith's co-authors include J.L. Gerlock, Mark E. Nichols, A.V. Kucherov, Giuseppe Rossi and R.O. Carter and has published in prestigious journals such as Macromolecules, Polymer Degradation and Stability and Progress in Organic Coatings