C.D. Breach

27 papers and 410 indexed citations i.

C.D. Breach has authored 27 papers that have received a total of 410 indexed citations. This includes 15 papers in Mechanical Engineering, 14 papers in Electrical and Electronic Engineering and 6 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloys Composites Properties (6 papers). C.D. Breach is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloys Composites Properties (6 papers) and collaborates with scholars based in Singapore, United Kingdom and Germany. C.D. Breach's co-authors include F. Wulff, Subodh G. Mhaisalkar, C.C. Wong and Thirumany Sritharan and has published in prestigious journals such as Polymer, Carbohydrate Polymers and Materials Science and Engineering A