Chai Tai Chong

20 papers and 43 indexed citations i.

Chai Tai Chong has authored 20 papers that have received a total of 43 indexed citations. This includes 20 papers in Electrical and Electronic Engineering, 5 papers in Electronic, Optical and Magnetic Materials and 2 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (15 papers) and Copper Interconnects and Reliability (5 papers). Chai Tai Chong is often cited by papers focused on 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (15 papers) and Copper Interconnects and Reliability (5 papers) and collaborates with scholars based in Singapore and Germany. Chai Tai Chong's co-authors include Chong Ser Choong, Batara Surya, A. D. Trigg, Fa Xing and Ser Choong Chong and has published in prestigious journals such as Microelectronics Reliability and IEEE Transactions on Components Packaging and Manufacturing Technology