Chang-Lin Yeh
About
Chang-Lin Yeh has authored 33 papers that have received a total of 609 indexed citations.
This includes 29 papers in Electrical and Electronic Engineering, 12 papers in Mechanics of Materials and 7 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (12 papers) and Electrostatic Discharge in Electronics (11 papers). Chang-Lin Yeh is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (12 papers) and Electrostatic Discharge in Electronics (11 papers) and collaborates with scholars based in Taiwan, Singapore and United States. Chang-Lin Yeh's co-authors include Yi‐Shao Lai, W.D. van Driel, Cheryl Selvanayagam, S.K.W. Seah and Y. S. Lai and has published in prestigious journals such as Journal of Alloys and Compounds, Materials Letters and International Journal of Impact Engineering
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