Changsoo Jang
About
Changsoo Jang has authored 28 papers that have received a total of 232 indexed citations.
This includes 14 papers in Electrical and Electronic Engineering, 10 papers in Mechanics of Materials and 9 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), Adhesion, Friction, and Surface Interactions (5 papers) and 3D IC and TSV technologies (4 papers). Changsoo Jang is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), Adhesion, Friction, and Surface Interactions (5 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in United States and South Korea. Changsoo Jang's co-authors include Bongtae Han, Sangmin Choi, Choongsik Bae, Seungbae Park and Young‐Rae Cho and has published in prestigious journals such as The Journal of Chemical Physics, Applied Physics Letters and Journal of Applied Physics.
In The Last Decade
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