Changsup Ryu
About
Changsup Ryu has authored 10 papers that have received a total of 404 indexed citations.
This includes 10 papers in Electrical and Electronic Engineering, 7 papers in Electronic, Optical and Magnetic Materials and 2 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Copper Interconnects and Reliability (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and Semiconductor materials and devices (4 papers). Changsup Ryu is often cited by papers focused on Copper Interconnects and Reliability (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and Semiconductor materials and devices (4 papers) and collaborates with scholars based in United States and South Korea. Changsup Ryu's co-authors include S.S. Wong, Kee-Won Kwon, C. Patrick Yue, Alvin L. S. Loke and C. F. Quate and has published in prestigious journals such as Applied Physics Letters, Acta Materialia and IEEE Transactions on Electron Devices
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