Chao-hong Wang

85 papers and 1.3k indexed citations i.

Chao-hong Wang has authored 85 papers that have received a total of 1.3k indexed citations. This includes 60 papers in Electrical and Electronic Engineering, 44 papers in Mechanical Engineering and 15 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (54 papers), 3D IC and TSV technologies (29 papers) and Intermetallics and Advanced Alloy Properties (29 papers). Chao-hong Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (54 papers), 3D IC and TSV technologies (29 papers) and Intermetallics and Advanced Alloy Properties (29 papers) and collaborates with scholars based in Taiwan, China and Sri Lanka. Chao-hong Wang's co-authors include Sinn-wen Chen, Ling Zhou, Qiuyun Fu, Fei Xue and Jiansheng Zhu and has published in prestigious journals such as Applied Physics Letters, ACS Applied Materials & Interfaces and Electrochimica Acta