Chase Cook

15 papers and 306 indexed citations i.

Chase Cook has authored 15 papers that have received a total of 306 indexed citations. This includes 9 papers in Electrical and Electronic Engineering, 6 papers in Electronic, Optical and Magnetic Materials and 3 papers in Hardware and Architecture. The topics of these papers are Semiconductor materials and devices (8 papers), Copper Interconnects and Reliability (6 papers) and Electronic Packaging and Soldering Technologies (5 papers). Chase Cook is often cited by papers focused on Semiconductor materials and devices (8 papers), Copper Interconnects and Reliability (6 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in United States, China and Germany. Chase Cook's co-authors include Sheldon X.-D. Tan, Zeyu Sun, Hans Rudi Fischer, Xiaoyi Wang and Yan Yan and has published in prestigious journals such as Mathematische Annalen, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems and IEEE Transactions on Very Large Scale Integration (VLSI) Systems.