Chia‐Ming Hsu

33 papers and 621 indexed citations i.

Chia‐Ming Hsu has authored 33 papers that have received a total of 621 indexed citations. This includes 18 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 6 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (6 papers) and Intermetallics and Advanced Alloy Properties (5 papers). Chia‐Ming Hsu is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (6 papers) and Intermetallics and Advanced Alloy Properties (5 papers) and collaborates with scholars based in Taiwan, United States and Japan. Chia‐Ming Hsu's co-authors include Sinn-wen Chen, Shih‐kang Lin, Jhe-Yu Lin, Hsin‐Jay Wu and Jing‐Ping Liou and has published in prestigious journals such as The Astrophysical Journal, Applied Physics Letters and Journal of Applied Physics.