Chia‐Ming Hsu

33 papers and 608 indexed citations i.

Chia‐Ming Hsu has authored 33 papers that have received a total of 608 indexed citations. This includes 18 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 6 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (6 papers) and Semiconductor materials and interfaces (5 papers). Chia‐Ming Hsu is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (6 papers) and Semiconductor materials and interfaces (5 papers) and collaborates with scholars based in Taiwan, United States and Japan. Chia‐Ming Hsu's co-authors include Sinn-wen Chen, Shih‐kang Lin, Jhe-Yu Lin, Yih Ho and Jing‐Ping Liou and has published in prestigious journals such as The Astrophysical Journal, Applied Physics Letters and Journal of Applied Physics