Chia‐Pin Chiu

14 papers and 430 indexed citations i.

Chia‐Pin Chiu has authored 14 papers that have received a total of 430 indexed citations. This includes 13 papers in Electrical and Electronic Engineering, 5 papers in Materials Chemistry and 4 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (6 papers) and Thermal properties of materials (5 papers). Chia‐Pin Chiu is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (6 papers) and Thermal properties of materials (5 papers) and collaborates with scholars based in United States, Germany and Taiwan. Chia‐Pin Chiu's co-authors include G. Chrysler, Ravi Mahajan, Chuang Wei, Hantang Qin and Jingyan Dong and has published in prestigious journals such as Proceedings of the IEEE, MRS Bulletin and Journal of Micromechanics and Microengineering