Chiapyng Lee
About
Chiapyng Lee has authored 65 papers that have received a total of 1.4k indexed citations.
This includes 52 papers in Electrical and Electronic Engineering, 28 papers in Electronic, Optical and Magnetic Materials and 20 papers in Mechanical Engineering. The topics of these papers are Copper Interconnects and Reliability (27 papers), Semiconductor materials and devices (27 papers) and Electronic Packaging and Soldering Technologies (21 papers). Chiapyng Lee is often cited by papers focused on Copper Interconnects and Reliability (27 papers), Semiconductor materials and devices (27 papers) and Electronic Packaging and Soldering Technologies (21 papers) and collaborates with scholars based in Taiwan, United States and China. Chiapyng Lee's co-authors include Yee‐Wen Yen, Yu‐Lin Kuo, Jing‐Cheng Lin, Chenglin Huang and Tri‐Rung Yew and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society
In The Last Decade
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