Chien‐Neng Liao
About
Chien‐Neng Liao has authored 89 papers that have received a total of 1.8k indexed citations.
This includes 59 papers in Materials Chemistry, 54 papers in Electrical and Electronic Engineering and 30 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Advanced Thermoelectric Materials and Devices (39 papers), Copper Interconnects and Reliability (25 papers) and Electronic Packaging and Soldering Technologies (22 papers). Chien‐Neng Liao is often cited by papers focused on Advanced Thermoelectric Materials and Devices (39 papers), Copper Interconnects and Reliability (25 papers) and Electronic Packaging and Soldering Technologies (22 papers) and collaborates with scholars based in Taiwan, United States and Italy. Chien‐Neng Liao's co-authors include Wen‐Wei Wu, K. N. Tu, Hsu-Shen Chu, Yu‐Lun Chueh and Lih‐Juann Chen and has published in prestigious journals such as Science, Advanced Materials and Nature Communications
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