Chih Chen

228 papers and 4.7k indexed citations i.

Chih Chen has authored 228 papers that have received a total of 4.7k indexed citations. This includes 194 papers in Electrical and Electronic Engineering, 103 papers in Electronic, Optical and Magnetic Materials and 60 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (147 papers), 3D IC and TSV technologies (121 papers) and Copper Interconnects and Reliability (97 papers). Chih Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (147 papers), 3D IC and TSV technologies (121 papers) and Copper Interconnects and Reliability (97 papers) and collaborates with scholars based in Taiwan, United States and Italy. Chih Chen's co-authors include K. N. Tu, Chien-Min Liu, K. N. Tu, Dinh-Phuc Tran and T. L. Shao and has published in prestigious journals such as Science, Journal of the American Chemical Society and Applied Physics Letters.