Chih Chen
About
Chih Chen has authored 226 papers that have received a total of 4.6k indexed citations.
This includes 191 papers in Electrical and Electronic Engineering, 104 papers in Electronic, Optical and Magnetic Materials and 60 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (146 papers), 3D IC and TSV technologies (119 papers) and Copper Interconnects and Reliability (98 papers). Chih Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (146 papers), 3D IC and TSV technologies (119 papers) and Copper Interconnects and Reliability (98 papers) and collaborates with scholars based in Taiwan, United States and Italy. Chih Chen's co-authors include K. N. Tu, Chien-Min Liu, K. N. Tu, Dinh-Phuc Tran and T. L. Shao and has published in prestigious journals such as Science, Journal of the American Chemical Society and Applied Physics Letters
In The Last Decade
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