Chih‐Ming Chen

225 papers and 3.7k indexed citations i.

Chih‐Ming Chen has authored 225 papers that have received a total of 3.7k indexed citations. This includes 124 papers in Electrical and Electronic Engineering, 55 papers in Materials Chemistry and 51 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (95 papers), 3D IC and TSV technologies (47 papers) and Copper Interconnects and Reliability (35 papers). Chih‐Ming Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (95 papers), 3D IC and TSV technologies (47 papers) and Copper Interconnects and Reliability (35 papers) and collaborates with scholars based in Taiwan, Hong Kong and United States. Chih‐Ming Chen's co-authors include Sinn-wen Chen, Hsuan Lee, Shien‐Ping Feng, Tzu‐Chien Wei and Ching Hsuan Lin and has published in prestigious journals such as Journal of Biological Chemistry, Journal of Applied Physics and Analytical Biochemistry