Chi-Won Hwang
About
Chi-Won Hwang has authored 13 papers that have received a total of 448 indexed citations.
This includes 12 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 2 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), Intermetallics and Advanced Alloy Properties (8 papers) and Advanced Welding Techniques Analysis (4 papers). Chi-Won Hwang is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Intermetallics and Advanced Alloy Properties (8 papers) and Advanced Welding Techniques Analysis (4 papers) and collaborates with scholars based in Japan, South Korea and United States. Chi-Won Hwang's co-authors include Katsuaki Suganuma, Keun‐Soo Kim, Shigeo Hashimoto, Jung-Goo Lee and Mi‐Suk Shin and has published in prestigious journals such as Materials Science and Engineering A, Journal of Alloys and Compounds and Journal of materials research/Pratt's guide to venture capital sources
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