Chong Leong Gan

27 papers and 240 indexed citations i.

Chong Leong Gan has authored 27 papers that have received a total of 240 indexed citations. This includes 20 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 6 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (13 papers) and Copper Interconnects and Reliability (5 papers). Chong Leong Gan is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (13 papers) and Copper Interconnects and Reliability (5 papers) and collaborates with scholars based in Malaysia and United States. Chong Leong Gan's co-authors include U. Hashim, Yiyu Chen, Yijing Chen, Richard E. Fan and Ji‐An Pan and has published in prestigious journals such as PLoS ONE, Journal of Electronic Materials and Microelectronics Reliability.