Chong Zhong
About
Chong Zhong has authored 9 papers that have received a total of 340 indexed citations.
This includes 7 papers in Mechanical Engineering, 3 papers in Electrical and Electronic Engineering and 3 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers) and Analytical Chemistry and Sensors (2 papers). Chong Zhong is often cited by papers focused on Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers) and Analytical Chemistry and Sensors (2 papers) and collaborates with scholars based in United States, Singapore and China. Chong Zhong's co-authors include Xiaoliang Zhu, Jiang Zhe, Sung Yi, Michelle S. Hoo Fatt and Jianping Hu and has published in prestigious journals such as Tribology International, Measurement Science and Technology and Journal of Sandwich Structures & Materials
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