Choong Don Yoo
About
Choong Don Yoo has authored 22 papers that have received a total of 483 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 7 papers in Mechanics of Materials. The topics of these papers are Welding Techniques and Residual Stresses (9 papers), 3D IC and TSV technologies (6 papers) and Electronic Packaging and Soldering Technologies (4 papers). Choong Don Yoo is often cited by papers focused on Welding Techniques and Residual Stresses (9 papers), 3D IC and TSV technologies (6 papers) and Electronic Packaging and Soldering Technologies (4 papers) and collaborates with scholars based in South Korea and United States. Choong Don Yoo's co-authors include Jae‐Hak Lee, Jihye Lee, Sang Kyu Choi, Sung H. Ko and Yong-Seog Kim and has published in prestigious journals such as Journal of Physics D Applied Physics, Sensors and Actuators A Physical and Pattern Recognition Letters
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