Chris Bencher

19 papers and 370 indexed citations i.

Chris Bencher has authored 19 papers that have received a total of 370 indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 6 papers in Biomedical Engineering and 6 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Advancements in Photolithography Techniques (14 papers), 3D IC and TSV technologies (6 papers) and Copper Interconnects and Reliability (6 papers). Chris Bencher is often cited by papers focused on Advancements in Photolithography Techniques (14 papers), 3D IC and TSV technologies (6 papers) and Copper Interconnects and Reliability (6 papers) and collaborates with scholars based in United States and Belgium. Chris Bencher's co-authors include Yong Mei Chen, Huixiong Dai, Li‐Wen Chang and H.‐S. Philip Wong and has published in prestigious journals such as IEEE Transactions on Semiconductor Manufacturing