Chris Bencher
About
Chris Bencher has authored 19 papers that have received a total of 371 indexed citations.
This includes 16 papers in Electrical and Electronic Engineering, 6 papers in Biomedical Engineering and 6 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Advancements in Photolithography Techniques (14 papers), 3D IC and TSV technologies (6 papers) and Copper Interconnects and Reliability (6 papers). Chris Bencher is often cited by papers focused on Advancements in Photolithography Techniques (14 papers), 3D IC and TSV technologies (6 papers) and Copper Interconnects and Reliability (6 papers) and collaborates with scholars based in United States and Belgium. Chris Bencher's co-authors include Yong Mei Chen, Huixiong Dai, H.‐S. Philip Wong and He Yi and has published in prestigious journals such as IEEE Transactions on Semiconductor Manufacturing.
In The Last Decade
Fields of papers published by Chris Bencher
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Chris Bencher
Since SpecializationCitations
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