Christian Witt
About
Christian Witt has authored 22 papers that have received a total of 391 indexed citations.
This includes 16 papers in Electronic, Optical and Magnetic Materials, 14 papers in Electrical and Electronic Engineering and 7 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (15 papers), Electrodeposition and Electroless Coatings (9 papers) and Electronic Packaging and Soldering Technologies (5 papers). Christian Witt is often cited by papers focused on Copper Interconnects and Reliability (15 papers), Electrodeposition and Electroless Coatings (9 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in United States, Germany and France. Christian Witt's co-authors include Conal E. Murray, Jean Jordan-Sweet, Paul R. Besser, R. Rosenberg and I. C. Noyan and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Physical Review B
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